Pixel mirror based stage lighting system

ABSTRACT

A lighting system with a digital micromirror device which forms a digital godo system that is controllable on a pixel level. The device includes a number of sensitive electronic elements. The device is controlled by two different controllers: a digital signal processor which is effectively the number crunching portion, and a controller, which controls the functions of the light. The controller also logs errors into a registery, such as a non-volatile memory. A field programmable gate array is used for a number of purposes, including to form the ports. One of those ports is a tech port, which is used to detect status of the light such as faults.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a divisional of and claims priority to U.S.application Ser. No. 09/756,037, filed Jan. 5, 2001, which is adivisional of U.S. application Ser. No. 09/145,313, filed Aug. 31, 1998,now U.S. Pat. No. 6,208,087.

[0002] The present invention describes improvements in a digital mirrorstage lighting system. More specifically, the present inventiondescribes techniques which are used to improved operation in the specialenvironment produced by the digital mirror stage lighting system.

BACKGROUND OF THE INVENTION

[0003] Stage lighting systems have increased in complexity in recentyears. It is desirable to be able to change literally any aspect of thebeam projected by a stage light from a remote location. Light & SoundDesign, the assignee of the present application, have suggested in otherpatents and applications that many of these issues couple be improved bya stage lighting system that uses an active, x, y addressable elementwith a digital micromirror device (“DMD”) available from TexasInstruments. These devices use an array of controllable mirrors toselectively reflect light in pixel units. These devices have also beencalled digital mirror, digital light processor (DLP), and other names.Light can be selectively reflected in units of picture elements orpixels. This allows total control of light shape and certain othercharacteristics. Other devices which are controllable to selectivelychange characteristics of pixels of light, such as a grating light valve(GLV), can also be used for this purpose.

[0004] These concepts are disclosed in several pending patentapplications of Light & Sound Design, including Ser. No. 08/854,353, thedisclosures of which are herewith incorporated by reference to theextent necessary for proper understanding.

[0005] The pixel based light processors, however, themselves producescertain issues, including control issues and cooling issues. The presentdisclosure describes these and other issues which were found to exist,and describes certain solutions found by the inventors to combat theseissues.

SUMMARY OF THE INVENTION

[0006] A number of aspects are described according to the presentinvention, and the following summary explains at least some of theseaspects.

[0007] A first aspect includes control of the digital mirror device(DMD) and other associated operations. The control is typicallycompletely digital, and many of the operations are carried out entirelymathematically. Therefore, a distributed control with a first controlelement that carries out mathematical calculations and a second controlelement which is optimized for control is desirable.

[0008] According to an aspect of the embodiment, the second controlelement is affected out entirely by a programmable gate array, such as afield programmable gate array or similar configurable device. Aparticularly preferred embodiment reconfigures the device after bulbstartup, to avoid noise danger during the bulb startup.

[0009] Another aspect is that the digital mirror has loses a certainamount of light. This has required brighter, and hence more powerintensive, bulbs. One aspect of this invention is relates to how theoperation occurs to keep the heat of the bulb and ignition of the bulbfrom affecting the other subsystems.

[0010] The great amount of heat has produced the need for advancedcooling techniques. However, the digital mirror has specializedtemperature requirements. According to this aspect, a pulse-driventhermo-electric cooler is used and the pulse width to the cooler ischanged to change the amount of cooling.

[0011] Other aspects of this invention describe the way in which thecontrol element carries out the operation.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] These and other aspects of the invention will now be described indetail with respect to the accompanying drawings, in which:

[0013]FIG. 1 shows a block diagram of the electronics of the system;

[0014]FIG. 2 shows a flowchart of operation of the system of thesupervisor;

[0015]FIG. 3 shows a block diagram of the supervisor hardware;

[0016]FIG. 4 shows a flowchart of operation of the different processescarried out by the supervisor;

[0017]FIGS. 5A and 5B show a service package type cooler and detectordevice.

[0018]FIG. 6 shows the thermoelectric cooler connected to the digitalmirror.

[0019]FIG. 7 shows a flowchart of the cooling operation carried out bythe thermoelectric device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020]FIG. 1 shows a block diagram of the electronic control system ofthe preferred embodiment. The TI DLP board 100 is an off the shelf boardfrom Texas Instruments which carries out control of the digital mirrorand other pre-defined functions. Associated functions for control ofthis system are carried out in a field programmable gate array 110 whichis preferably of the electronically reconfigurable type. This device isreconfigured into certain logical devices.

[0021] The video is controlled by a digital signal processor 150, inthis case, a 320C80. The digital signal processor (“DSP”) 150 carriesout certain operations under control of the user. DSP 150 also includestwo different kinds of slave memory, a flash memory 152 which includesthe main program for the DSP 150 and which also includes certain shapesfor various controlled lights. Certain information is also stored insynchronous DRAM 154. On start up, the initial program is transferredfrom flash memory 152 into the sync DRAM 154 and used to control thedigital signal processor 150 and certain other aspects of theelectronics. The video device produces an output in the form used by theDLP board 114.

[0022] Serial port 114 is connected to receive data from the controlledconsole 116. This data can be sent in any desired serial format and theinformation is placed on the main data bus 160. Another serial port 118is an RS-485 bus driver to form the motor control bus which is describedfurther herein. An IIC port 120 is also formed for other communicationoperation.

[0023] Serial data from the console 116 received via a serial port 114is input directly to the master digital signal processor (“DSP”) 150,which is preferably a Texas Instruments multimedia video processor(“MVP”) model number TMS320C80. DSP 150 uses the information to providea serial port output which is converted to RS-485 protocol by bus driverserial port driver 118. The motor control bus is preferably an RS485 buswhich controls and communicates with each of the motor subsystems asdescribed in our copending applications.

[0024] Each of the motor control subsystems is a separated unitincluding all of the hardware necessary to control its associated motorand other hardware according to applied commands. The motor controlsubsystem includes a dedicated control structure. For example, apan/tilt motor subsystem includes all controlling structure for themotor, and the motor itself. This combination allows a modularoperation, precise matching between components, and more accuratecalibration.

[0025] Master DSP 150 has primary responsibility for controllingoperations of the lamp including control of the DMD. This latteroperation requires computation of complex operations to provide controlinformation for the DMD. At times, these calculations leave little timefor the master DSP 150 to do much else.

[0026] A separate supervisor system 199 has primary responsibility formonitoring status of the lamp and making decisions based on that status.Supervisor 199 is also connected to the motor control bus. Supervisor199 is preferably a microcontroller as described herein. Themicrocontroller monitors status of the subsystems including the master.The microcontroller can also control the motor control bus when thedetermined status makes that appear it becomes desirable or necessary.

[0027] Unlike digital signal processor 150, however, the microcontrolleris a very technically simple device, adapted for watching the bus andother devices, and monitoring for errors. The microcontroller carriesout minimal number crunching; its primary function is to protect anddiagnose faults. The supervisor also controls various other functions inthe system.

[0028] The supervisor 199 monitors the output of temperature sensors tomonitor and control various temperatures within the system. Supervisor199 is also connected to the ballast of the lamp to monitor thecondition and operation of the ballast. Finally, supervisor 199 receivespossible program parameters from flash memory unit 152.

[0029] The operation of the DMD 100 is controlled by master DSP 156 toform any light shape which can be described as a plurality of pixels. Alibrary of possible shapes is stored in image SDRAM 154.

[0030] The serial communications device 114 can also be a dual port RAMwith a mailbox. In this case, the information is set into the RAM, andis flagged. The DSP 150 monitors for new data by investigating the flagto determine whether the flag is set. Whenever the flag is set, DSP 150retrieves the new information from the RAM and appropriately processesit.

[0031] As described above, many of the control device structures can beeffected using a field programmable gate array 110. More specifically,any communications port or communications driver, and/or any and alloutput buffers are preferably formed by reconfiguration of the FPGA. Thestructures can be described using hardware definition language “HDL” oreach of the electronic structures can be configured. Many various cannedconfigurations for FPGAs are well known.

[0032] The operation of the system is controlled according to theflowchart of FIG. 2. The system initially boots at step 200, whichrequires transferring the system program from protected flash memory 152to SDRAM 154, and beginning operation. At step 202 a global reset isgenerated. This global reset includes at least the DSP reset vector, andmay also force a mechanical reset of all motors.

[0033] After the reset at step 202, the DSP main loop is running. TheDSP main loop then sends a command to configure the FPGA 110 at step204. The command to configure the FPGA 110 causes the FPGA to form thedifferent logical blocks shown in FIG. 1. After this, the DSP loopcontinues shown generically as step 206. This includes receivingcommands from the console, and other housekeeping functions. The normalloop continues until an ignite lamp command is received at step 208. Thelamp is a very high powered lamp, and requires an inductive ballast foroperation. The transients produced by the lamp ignition can cause noisetransients in the rest of the system.

[0034] When the ignite lamp command is received at step 208, acorresponding command is sent to the supervisor subsystem indicatingsame at step 210. The supervisor is a low level system, as describedabove, which is optimized for control of faults. The supervisor hasoverall control of many of the reset functions, and at step 212,initiates a responsive reset. This includes including a break on themotor control bus, holding all the serial com ports in reset, andcommanding all boards attached to the supervisor into a hard resetstate. The operations in step 212 are done to prepare the system for theinevitable electromagnetic pulse that will be produced by the strikingof the bulb. Once all of the above is completed, at step 214, thesupervisor program is halted, and the lamp is ignited. This ignitionuses a special subprogram during which no other operations are carriedout.

[0035]FIG. 2 shows this as halting the supervisor program. After thelamp is ignited at step 214, the supervisor and all subsystems arereleased from reset at step 216. Operation then returns to the normalsupervisor loop and the normal DSP loop shown as 230.

[0036] The supervisor, as described above, is optimized for lower leveloperations and monitoring; compared with the higher level numbercrunching operations which are carried out by digital signal processor150. A block diagram of the supervisor is shown in FIG. 3. A low levelmicrocontroller such as the 8051 forms the microcontrolling operation. Apower supply/regulator 302 supplies microcontroller 300 with its ownsource of power. This is done to minimize problems from other powersupplies.

[0037] An external interface to supervisor 199 is provided by the techport 310. The tech port 310 is connected to a tech port interface 312which connects to the microcontroller through a UART. The tech portenables certain operations of the lamp to be individually controlledthrough the simplified serial interface.

[0038] An optional indicator subsystem 320 provides indications ofpower, data, and error for the operation of the lamp.

[0039] Ballast interface 330 connects to the lamp ballast and controlsits operation.

[0040] The tech port also includes temperature sensor interface 340. Thetemperature sensors connect to that interface. An IIC bus driver is alsoprovided as element 350.

[0041] The microcontroller uses associated RAM 360 and real time clock,which is battery powered by battery 362.

[0042] The microcontroller 8051 also includes an RS-485 interface 370which forms a motor control bus (“MCB”).

[0043] As described above, many of the features of the supervisorincluding the interface elements 312/314, 350 and 370 can be configuredout of a field programmable gate array.

[0044] The IIC bus 352 connects to a number of different devices,including ROM 354 which includes the yoke serial number, another memoryincluding the head serial number, information indicative of the ballastserial number and the temperature sensor, and the like.

[0045] The supervisor tracks bulb life by storing an indication of bulbchanging along with the current time stamp, each time a new bulb isplaced into service. Time stamps for other events are also stored. Thesupervisor also keeps track of certain events, including removal ofcertain subsystems. It is presumed that these subsystems are servicedwhen removed. All of this information is stored in a system “registry”in EEPROM 354.

[0046] Certain changes which cannot be automatically detected, such asthe time since bulb change, are manually entered into the registrythrough the tech port 310.

[0047] The information in the registry can be read by the serial deviceover tech port 310.

[0048] An alterative embodiment allows the information to be commandedto be displayed by the lamp itself as a diagnostic gobo. A lamp displaycommand causes the messages to be converted to fonts and used to controlthe DMD 100 to display the text error message by shaping the text lightoutput. This allows detecting the contents of the registry without adedicated display terminal using the existing digital light alteringdevice as a display mechanism. This effectively uses the gobo functionof pixel-level addressable device to form a diagnostic function.

[0049] The supervisor has a number of operating modes including theinitialization mode, locking mode, general task mode, error mode, andtechnician mode. Each of these modes will be described with reference tothe flowchart of FIG. 4.

[0050] The supervisor is initially started in the initialization mode.This mode can use any number of specific internal self tests. The selftests are well known in the art, and are shown generically as step 400.The internal tests include, but are not limited to, the following:

[0051] Internal clock running

[0052] External Ram test

[0053] IIC bus test

[0054] Supervisor temperature sensor test

[0055] IIC related bus tests:

[0056] Chassis serial number check

[0057] Head serial number check

[0058] Ballast serial number check

[0059] Ballast temperature sensor check

[0060] Remote temperature sensor board test

[0061] TEC board test

[0062] Thermocouples present tests

[0063] MCB device tests:

[0064] DSP master serial number

[0065] Color disk 1 serial number

[0066] Color disk 2 serial number

[0067] Rear zoom lens serial number

[0068] Front zoom lens

[0069] Focus lens

[0070] Shutter

[0071] Custom color

[0072] RGB wheel

[0073] Pan

[0074] Tilt

[0075] If the device completes all these tests, control passes to thenext mode called the logging mode. The supervisor continually logscertain error messages. Step 402 shows a 2-second interrupt drivenoutput routine. The output routine outputs temperature data and bulb runtime every 2 seconds. The error messages can be output every 2 seconds.An alternate technique outputs all data changes as they occur. Theoutput preferably occurs via the tech port 310 although alternatelyoutput can be carried out in some other way.

[0076] The internal motors of the lamp are also monitored for errormessages over the MCB. Each drive module can produce either an errormessage or a lack of response. Either the error message or the lack ofresponse can be taken as an error.

[0077] Certain errors are considered fatal errors and detected at step406. For example, over-temperature errors are considered to be fatal,and certain failed movement errors can be considered as fatal. If afatal error is determined at step 406, then the bulb is turned off atstep 408 to prevent damage, or an erratically-acting lamp unit. Anerrant light will produce much less visual anomalies if not properlyilluminated.

[0078] Once the system is placed into the error mode at step 408, itremains that way until the technician takes control of the fixture usingthe tech port terminal.

[0079] The general task processing loop begins at step 410 with readingtemperature sensors and error messages and outputting these values tothe tech port as necessary. A number of operations are carried outduring these general tasks. The lamp is also carefully monitored.

[0080] Each time through the loop, the general tasks shown generally asstep 412 are also. carried out. These general tasks include:

[0081] Incrementing lamp run time counter

[0082] Incrementing bulb run time counter if bulb is lit

[0083] Entering time and date stamp for lamp turn on

[0084] Entering time and date stamp for bulb on and off events

[0085] Lamp status after self check

[0086] Change of assembly including new serial number after change ofassembly

[0087] Snapshot of temperatures

[0088] Also errors are logged including non-fatal and fatal errors withtime and date stamp information for thes errors.

[0089] At any time during the operation, the technician can take controlof the system, shown as step 420. Normal operation of the lamp issuspended when the technician takes control. This is shown as step 422which requires a halt when the technician mode is detected at step 420..In technician mode, the system allows:

[0090] Clearing the contents of logged memory by downloading the log

[0091] Performing set moves to allow the technician to check lampoperation

[0092] Run a built-in light “chase”

[0093] View error logs in detail or obtain a status check

[0094] Perform diagnostic tests and fault finding using the terminalbased on error codes

[0095] Downlet preset messages to assemblies via the supervisor to testvarious operations

[0096] In the tech mode, various errors can also be detected anddisplayed. Each error code has an associated tech string used todescribe the error in plain but abbreviated English. This tech string istransmitted through the serial port 312 to the hand held terminal fordisplay. Various tests are described herein.

[0097] The following list details certain types and categories of errorsthat can be detected. This allows the technician to determine if thoseerrors are fatal or non-fatal.

[0098] IIC Bus Start Condition Test

[0099] Purpose:

[0100] Checks that the clock and data lines of the IIC bus respondcorrectly when a start condition is generated on the IIC bus.

[0101] Called:

[0102] Each time an IIC start subroutine is called.

[0103] Errors Reported:

[0104] None; if an error is detected, the IIC bus test routine iscalled.

[0105] IIC BUs Test

[0106] Purpose:

[0107] Checks that the clock and data lines of the IIC bus respondcorrectly.

[0108] Called:

[0109] At start up and on each read to an IIC device if the lines do notrespond correctly during the generation of a start condition (IIC BusStart Test).

[0110] Errors Reported:

[0111] Data line lo.

[0112] Date line Hi.

[0113] Clock line lo.

[0114] Clock line Hi.

[0115] Clock and data line shorted to each other.

[0116] This test looks for the correct operation of the IIC bus clockand data lines. All error codes produced by these tests are FATALbecause none of the devices on the bus will be accessible to thesupervisor. The supervisor sets the clock and data lines hi and waitsfor one IIC bus clock cycle. The lines are then tested (testing the portpins, not the output latches of the micro controller). If they are in ahi state, two possible errors can be detected at this point; data linepulled low or clock line pulled low.

[0117] IIC Acknowledge Test

[0118] Purpose:

[0119] Checks that the selected IIC device which has been addressedgenerates an acknowledge signal within 32 IIC bus clock cycles.

[0120] Called:

[0121] After any IIC bus address has been issued to talk to a device.

[0122] Errors Reported:

[0123] Remote temperature sensing PCG missing.

[0124] Ballast temperature sensor missing.

[0125] Thermo-electric controller board missing.

[0126] Ballast Rom missing.

[0127] Yoke Rom missing.

[0128] Head Rom missing.

[0129] Supervisor temperature sensor missing.

[0130] Broken/Missing Thermocouple Test

[0131] Purpose:

[0132] Checks that the selected thermocouple on the remote temperaturesensing board is present. If it is missing or broken, it will be flaggedas bad in the corresponding status byte for the thermocouple channel.

[0133] Called:

[0134] When each thermocouple is read.

[0135] Errors Reported:

[0136] Thermocouple 1 broken or missing.

[0137] Thermocouple 2 broken or missing.

[0138] Thermocouple 3 broken or missing.

[0139] Thermocouple 4 broken or missing.

[0140] Thermocouple 5 broken or missing.

[0141] Thermocouple 6 broken or missing.

[0142] Thermocouple 7 broken or missing.

[0143] Thermocouple 8 broken or missing.

[0144] Note:

[0145] There may be further thermocouples on the TEC board which will belabeled T9 to Tn.

[0146] Clock Test

[0147] Purpose:

[0148] Checks that the external time-keeper is running by checking thatthe seconds register increases by 1 second timed by the micro running asoftware generated delay.

[0149] Called:

[0150] At start-up.

[0151] Errors Reported:

[0152] Clock error.

[0153] Note:

[0154] It is also possible to test other registers (i.e., minutes ordate) for the numbers being in a valid range if desired.

[0155] External Ram Test

[0156] Purpose:

[0157] Checks that the external battery backed ram can be read andwritten.

[0158] Called:

[0159] At start-up.

[0160] Errors reported:

[0161] Read write error.

[0162] Note:

[0163] It may make sense to have this as part of the clock test routineas a missing clock will probably mean missing ram.

[0164] Thermocouple Limit Test

[0165] Purpose:

[0166] Checks that a selected thermocouple channel temperature. readinghas not exceeded a pre-set limit.

[0167] Called:

[0168] When a thermocouple temperature channel is read.

[0169] Errors Reported:

[0170] Thermocouple 1 exceeded pre-set temperature.

[0171] Thermocouple 2 exceeded pre-set temperature.

[0172] Thermocouple 3 exceeded pre-set temperature.

[0173] Thermocouple 4 exceeded pre-set temperature.

[0174] Thermocouple 5 exceeded pre-set temperature.

[0175] Thermocouple 6 exceeded pre-set temperature.

[0176] Thermocouple 7 exceeded pre-set temperature.

[0177] Thermocouple 8 exceeded pre-set temperature.

[0178] Thermocouple 1 exceeded upper temperature limit.

[0179] Thermocouple 2 exceeded upper temperature limit.

[0180] Thermocouple 3 exceeded upper temperature limit.

[0181] Thermocouple 4 exceeded upper temperature limit.

[0182] Thermocouple S exceeded upper temperature limit.

[0183] Thermocouple 6 exceeded upper temperature limit.

[0184] Thermocouple 7 exceeded upper temperature limit.

[0185] Thermocouple 8 exceeded upper temperature limit.

[0186] Thermocouple differential pre-set exceeded.

[0187] Thermocouple differential upper limit exceeded.

[0188] Note:

[0189] Two types of limits have been outlined. The pre-set limit warnsthat temperatures are starting to get dangerously high and may pointtowards a filter on an air intake becoming blocked and requiringcleaning for example. This type of error would be non-fatal. If theupper temperature level is exceeded it becomes a fatal error and thesupervisor would have to take steps to protect the fixture. The last twodifferential errors relate to the temperature measurement on the DMD andthe thermoelectric cooling. To prevent damage to the device, thetemperature difference cannot exceed a certain level.

[0190] Digital Temperature Sensor Limit Test

[0191] Purpose:

[0192] Checks that a selected digital temperature sensor reading has notexceeded a pre-set limit.

[0193] Called:

[0194] When a digital temperature sensor is read.

[0195] Error Reported:

[0196] Supervisor exceeded pre-set temperature.

[0197] Ballast exceeded pre-set temperature.

[0198] Supervisor exceeded upper temperature limit.

[0199] Ballast exceeded upper temperature limit

[0200] Note:

[0201] Two types of limits have been outlined. The pre-set limit warnsthat temperatures are starting to get dangerously high and may pointtowards a filter on an air intake becoming blocked and requiringcleaning for example. This type of error would be non-fatal.

[0202] If the proper temperature level is exceeded, it becomes a fatalerror and the supervisor carries out the processing steps to protect thefixture.

[0203] It may well be that no actions will be available to thesupervisor to prevent damage other than reducing the power consumptionof the fixture.

[0204] IIC Serial Number Tests

[0205] Purpose:

[0206] Checks electronic serial number of assemblies on the IIC bus.

[0207] Called:

[0208] During start up.

[0209] Errors Reported:

[0210] Ballast serial number changed.

[0211] Remote temperature sensor PCB serial number changed.

[0212] TEC serial number changed.

[0213] Yoke serial number changed.

[0214] Head serial number changed.

[0215] Ballast serial number missing/invalid.

[0216] Remote temperature sensor PCB serial number missing/invalid.

[0217] TEC serial number missing/invalid.

[0218] Yoke serial number missing/invalid.

[0219] Head serial number missing/invalid.

[0220] Note:

[0221] Two types of errors have been outlined. A missing serial numbererror may only be required during manufacturing and testing.

[0222] MCB Serial Number Checks

[0223] Purpose:

[0224] Checks electronic serial number of assemblies on the MCB bus.

[0225] Called:

[0226] During start up.

[0227] Errors Reported:

[0228] DSP master serial number changed.

[0229] Pan assembly serial number changed.

[0230] Tilt assembly serial number changed.

[0231] Lens 1 assembly serial number changed.

[0232] Lens 1 assembly serial number changed.

[0233] Focus assembly serial number changed.

[0234] RGB assembly serial number changed.

[0235] Color disk 1 assembly serial number changed.

[0236] Color disk 2 assembly serial number changed.

[0237] Customer color disk assembly serial number changed.

[0238] Ballast serial number missing/invalid.

[0239] Remote temperature sensor PCB serial number missing/invalid.

[0240] TEC serial number missing/invalid.

[0241] Yoke serial number missing/invalid.

[0242] Head serial number missing/invalid.

[0243] Note:

[0244] Two types of errors have been outlined. A missing serial numbererror may only be required during manufacturing and testing. If a modulefails to respond, it can be used to detect the absence of a drivemodule.

[0245] MCB Bus Status Byte Tests

[0246] Purpose:

[0247] Checks status bytes of drive modules on the MCB bus.

[0248] Called:

[0249] During monitoring of MCB bus.

[0250] Errors Reported:

[0251] Pan has failed to reset.

[0252] Pan drive module over pre-set temperature.

[0253] Pan drive module has exceeded maximum temperature.

[0254] Pan assembly detected MCB errors.

[0255] Tilt has failed to reset.

[0256] Tilt drive module over pre-set temperature.

[0257] Tilt drive module has exceeded maximum temperature.

[0258] Tilt assembly detected MCB errors.

[0259] Lens 1 failed to reset.

[0260] Lens 1 drive over pre-set temperature.

[0261] Lens 1 has exceeded maximum temperature.

[0262] Lens 1 lost position.

[0263] Lens 1 assembly detected MCB errors.

[0264] Lens 2 failed to reset.

[0265] Lens 2 drive over pre-set temperature.

[0266] Lens 2 has exceeded maximum temperature.

[0267] Lens 2 lost position.

[0268] Lens 2 assembly detected MCB errors.

[0269] Focus failed to reset.

[0270] Focus drive over pre-set temperature.

[0271] Focus has exceeded maximum temperature.

[0272] Focus lost position.

[0273] Focus assembly detected MCB errors.

[0274] Color 1 failed to reset.

[0275] Color 1 drive over pre-set temperature.

[0276] Color 1 has exceeded maximum temperature.

[0277] Color 1 lost position.

[0278] Color 1 assembly detected MCB errors.

[0279] Color 2 failed to reset.

[0280] Color 2 drive over pre-set temperature.

[0281] Color 2 has exceeded maximum temperature.

[0282] Color 2 lost position.

[0283] Color 2 assembly detected MCB errors.

[0284] Custom color failed to reset.

[0285] Custom color drive over pre-set temperature.

[0286] Custom color has exceeded maximum temperature.

[0287] Custom color lost position.

[0288] Custom assembly detected MCB errors.

[0289] RGB locator failed to reset.

[0290] RGB locator drive over pre-set temperature.

[0291] RGB locator has exceeded maximum temperature.

[0292] RGB locator lost position.

[0293] RGB assembly detected MCB errors.

[0294] Shutter failed to reset.

[0295] Shutter drive over pre-set temperature.

[0296] Shutter has exceeded maximum temperature.

[0297] Shutter lost position.

[0298] Shutter assembly detected MCB errors.

[0299] DSP RAM error.

[0300] DSP ROM error.

[0301] DSP FPGA error.

[0302] DLP IIC bus error 1.

[0303] DLP IIC bus error 2.

[0304] DLP IIC bus error 3.

[0305] DLP IIC bus error 4.

[0306] ICON data errors (errors detected by DSP master).

[0307] MCB bus data errors (framing and parity errors detected bysupervisor).

[0308] Note:

[0309] Two types of errors have been outlined. A missing serial numbererror may only be required during manufacturing and testing.

[0310] Definition of errors details how they are detected and if theyare fatal or non-fatal. This would require outlining how the operatorwill perceive the error.

[0311] The preferred hand held terminal for the tech port is a micropalm1200 which has a 320×200 pixel display with gray scale.

[0312] The terminal allows different operations to be displayed. FIG. 5shows a graphical representation of different temperature readings to beshown on the display. Time graphs of errors could also be displayed,e.g., a time access representing the fixture's running time with eachcolumn representing, for example, 10 hours of time.

[0313] Operation over the tech port allows the following operations.

[0314] Diagnostic Mode

[0315] Mode accessed by PIN number or password.

[0316] Automatic log-in to supervisor with the required terminal detailssent to be logged and date and time stamped by the supervisor.

[0317] Request a test of the lamp by the supervisor.

[0318] View error log to see what errors may have occurred.

[0319] View serial number of lamp.

[0320] Check bulb burn time.

[0321] Run diagnosis routine to fault-find lamp based on the tests.

[0322] Save messages in assembly ROMS for use by service department.

[0323] Make copies of logs in the lamp for detail examination by servicedepartment, i.e., transferring to a computer to be sent by modem.

[0324] Manual Mode

[0325] Control the lamp using the displayed menu allowing:

[0326] Pan

[0327] Tilt

[0328] Zoom

[0329] Shutter

[0330] Color

[0331] Gobos

[0332] Strike

[0333] Douse

[0334] A test chase can also be done, with the facility to turnindividual functions on and off as required.

[0335] Service Mode

[0336] This allows downloading of memory contents at a servicedepartment and is to be done automatically by placing the terminal intoa cradle with the data being collected onto a PC.

[0337] Each error condition that can be detected will either be FATAL orNON-FATAL and will have a text message string associated with it used todescribe the error in English. This section lists all the errors so adecision can be made to the type of error and corresponding message.2.1.0 Each NON-FATAL error will be prefixed with the string - “!ERROR”2.2.0 Bach FATAL error will be prefixed with the string - “!FATAL ERROR”2.3.0 IIC bus errors. (All IIC bus errors are probably Fatal) (Fatal)ET: Message: 2.3.1 Data line shorted to 0V (Fatal) ET: Message: 2.3.2Data line shorted to 5V (Fatal) ET: Message: 2.3.3 Clock line shorted to0V (Fatal) ET: Message: 2.3.4 Clock line shorted to 5V (Fatal) ET:Message: 2.3.5 Clock and data line shorted to each other (Fatal) ET:Message: Note: If the IIC bus is faulty no data transactions can occur.2.4.0 Remote temperature sensing PCB missing (Fatal) ET: Message: 2.5.0Ballast temperature sensor missing ET: Message: 2.6.0 Thermo-electriccontroller board missing (Fatal) ET: Message: Note: The TEC board willcontrol the temperature of the DMD using the thermo-electric controller2.7.0 Ballast Rom missing ET: Message: 2.8.0 Yoke Rom missing ET:Message: 2.9.0 Head Rom missing ET: Message: 2.10.0 Supervisortemperature sensor missing ET: Message: 2.11.0 Thermocouple 1 broken ormissing ET: Message: 2.12.0 Thermocouple 2 broken or missing ET:Message: 2.13.0 Thermocouple 3 broken or missing ET: Message: 2.14.0Thermocouple 4 broken or missing ET: Message: 2.15.0 Thermocouple 5broken or missing ET: Message: 2.16.0 Thermocouple 6 broken or missingET: Message: 2.17.0 Thermocouple 7 broken or missing ET: Message: 2.18.0Thermocouple 8 broken or missing ET: Message: 2.19.0 Clock error ET:Message: 2.20.0 Thermocouple 1 exceeded pre-set temperature (Non-Fatal)ET: Message: 2.21.0 Thermocouple 2 exceeded pre-set temperature(Non-Fatal) ET: Message: 2.22.0 Thermocouple 3 exceeded pre-Settemperature (Non-Fatal) ET: Message: 2.23.0 Thermocouple 4 exceededpre-set temperature (Non-Fatal) ET: Message: 2.24..0 Thermocouple 5exceeded pre-set temperature (Non-Fatal) ET: Message: 2.25.0Thermocouple 6 exceeded pre-set temperature (Non-Fatal) ET: Message:2.26.0 Thermocouple 7 exceeded pre-set temperature (Non-Fatal) ET:Message: 2.27.0 Thermocouple 8 exceeded pre-set temperature (Non-Fatal)ET: Message: 2.28.0 Thermocouple 1 exceeded upper temperature limit(Fatal) ET: Message: 2.29.0 Thermocouple 2 exceeded upper temperaturelimit (Fatal) ET: Message: 2.30.0 Thermocouple 3 exceeded uppertemperature limit (Fatal) ET: Message: 2.31.0 Thermocouple 4 exceededupper temperature limit (Fatal) ET: Message: 2.32.0 Thermocouple 5exceeded upper temperature limit (Fatal) ET: Message: 2.33.0Thermocouple 6 exceeded upper temperature limit (Fatal) ET: Message:2.34.0 Thermocouple 7 exceeded upper temperature limit (Fatal) ET:Message: 2.35.0 Thermocouple 8 exceeded upper temperature limit (Fatal)ET: Message: 2.36.0 Thermocouple differential pre-set exceeded(Non-Fatal) ET: Message: 2.37.0 Thermocouple differential upper limitexceeded (Fatal) ET: Message: 2.38.0 Supervisor exceeded pre-settemperature (Non-Fatal) ET: Message: 2.39.0 Ballast exceeded pre-settemperature (Non-Fatal) ET: Message: 2.40.0 Supervisor exceeded uppertemperature limit (Fatal) ET: Message: Note: The supervisor has aLithium battery in its external RAM. This will pose a hazard if operatedat high temperatures. 2.41.0 Ballast exceeded upper temperature limit(Fatal) ET: Message: 2.42.0 Ballast serial number changed ET: Message:2.43.0 Remote temperature sensor PCB serial number changed ET: Message:2.44.0 TEC serial number changed ET: Message: 2.45.0 Yoke serial numberchanged ET: Message: 2.46.0 Head serial number changed ET: Message:2.47.0 Ballast serial number missing/invalid ET: Message: 2.48.0 Remotetemperature sensor PCB serial number missing/invalid 2.49.0 TEC serialnumber missing/invalid ET: Message: 2.50.0 Yoke serial numbermissing/invalid ET: Message: 2.51.0 Head serial number missing/invalidET: Message: 2.52.0 DSP master serial number changed ET: Message: 2.53.0Pan assembly serial number changed ET: Message: 2.54.0 Tilt assemblyserial number changed ET: Message: 2.55.0 Lens 1 assembly serial numberchanged ET: Message: 2.56.0 Lens 1 assembly serial number changed ET:Message: 2.57.0 Focus assembly serial number changed ET: Message: 2.58.0RGB assembly serial number changed ET: Message: 2.59.0 Color disk 1assembly serial number changed ET: Message: 2.60.0 Color disk 2 assemblyserial number changed ET: Message: 2.61.0 Custom Color disk assemblyserial number changed ET: Message: 2.62.0 Ballast serial numbermissing/invalid ET: Message: 2.63.0 Remote temperature sensor PCB serialnumber missing/invalid ET: Message: 2.64.0 TEC serial numbermissing/invalid ET: Message: 2.65.0 Yoke serial number missing/invalidET: Message: 2.66.0 Head serial number missing/invalid ET: Message:2.67.0 Pan has failed to reset ET: Message: 2.68.0 Pan drive module overpre-set temperature 2.69.0 Pan drive module has exceeded maximumtemperature ET: Message: 2.70.0 Pan assembly detected MCB errors ET:Message: 2.71.0 Tilt has failed to reset ET: Message: 2.72.0 Tilt drivemodule over pre-set temperature ET: Message: 2.73.0 Tilt drive modulehas exceeded maximum temperature ET: Message: 2.74.0 Tilt assemblydetected MCB errors ET: Message: 2.75.0 Lens 1 failed to reset ET:Message: 2.76.0 Lens 1 drive over pre-set temperature ET: Message:2.77.0 Lens 1 has exceeded maximum temperature ET: Message: 2.78.0 Lens1 lost position ET: Message: 2.79.0 Lens 1 assembly detected MCB errorsET: Message: 2.80.0 Lens 1 corrected loss of position ET: Message:2.81.0 Lens 2 failed to reset ET: Message: 2.82.0 Lens 2 drive overpre-set temperature ET: Message: 2.83.0 Lens 2 has exceeded maximumtemperature ET: Message: 2.84.0 Lens 2 lost position ET: Message: 2.85.0Lens 2 assembly detected MCB errors ET: Message: 2.86.0 Lens 2 correctedloss of position ET: Message: Note: Lens 1 and 2 form the zoom functionand share the same mechanical assembly. If one lens has failed to resetor lost position, it may mean that the second lens may collide with thefirst so both will have to be shut down to prevent damage. 2.87.0 Focusfailed to reset ET: Message: 2.88.0 Focus drive over pre-set temperatureET: Message: 2.89.0 Focus has exceeded maximum temperature ET: Message:2.90.0 Focus lost position ET: Message: 2.91.0 Focus assembly detectedMCB errors ET: Message: 2.92.0 Focus corrected loss of position ET:Message: 2.94.0 Color 1 drive over pre-set temperature ET: Message:2.95.0 Color 1 has exceeded maximum temperature ET: Message: 2.96.0Color 1 lost position ET: Message: 2.97.0 Color 1 assembly detected MCBerrors ET: Message: 2.98.0 Color 1 corrected loss of position ET:Message: 2.99.0 Color 2 failed to reset ET: Message: 2.100.0 Color 2drive over pre-set temperature ET: Message: 2.101.0 Color 2 has exceededmaximum temperature ET: Message: 2.102.0 Color 2 lost position ET:Message: 2.103.0 Color 2 assembly detected MCB errors ET: Message:2.104.0 Color 2 corrected loss of position ET: Message: 2.105.0 Customcolor failed to reset ET: Message: 2.106.0 Customer color drive overpre-set temperature ET: Message: 2.107.0 Custom color has exceededmaximum temperature ET: Message: 2.108.0 Custom color lost position ET:Message: 2.109.0 Custom assembly detected MCB errors ET: Message:2.110.0 Customer corrected loss of position ET: Message: 2.111.0 RGBlocator failed to reset ET: Message: 2.112.0 RGB locator drive overpre-set temperature ET: Message: 2.113.0 RGB locator has exceededmaximum temperature ET: Message: 2.114.0 RGB locator lost position ET:.Message: 2.115.0 RGB assembly detected MCB errors ET: Message: 2.116.0Shutter failed to reset ET: Message: 2.117.0 Shutter drive over pre-settemperature ET: Message: 2.118.0 Shutter has exceeded maximumtemperature ET: Message: 2.119.0 Shutter lost position ET: Message:2.120.0 Shutter assembly detected MCB errors ET: Message: 2.121.0Shutter corrected loss of position ET: Message: 2.122.0 DSP RAM errorET: Message: 2.123.0 DSP ROM error ET: Message: 2.124.0 DSP FPGA errorET: Message: 2.125.0 DLP IIC bus error 1 ET: Message: 2.126.0 DLP IICbus error 2 ET: Message: 2.127.0 DLP IIC bus error 3 ET: Message:1.128.0 DLP IIC bus error 4 ET: Message: 2.129.0 ICON data errors(errors detected by DSP master) ET: Message: 2.130.0 MCB bus data errors(framing and parity errors detected by supervisor) ET: Message:

[0338] Another operation which can be carried out is the diagnosticgobo. This allows the system to be monitored from the console.Specifically, since the digital mirror device can arrange the shape oflight into any desired shape, it can include font shapes. This enablesthe technician to use the console to focus the image on a screen or anysuitable surface. Lamp status can then be seen by the fonts which areprestored and projected by the fixture. This enables checking an entiresystem relatively quickly.

[0339] The same error handling techniques are used, and in this case,the DSP 250 can store font information. This enables projecting thediagnostic gobo information. Of course, certain faults may prevent thediagnostic gobo from operating. For example, if the DSP is not workingor if zoom or focus has a problem, then the image is not readable.Failure of pan and tilt may prevent moving the lamp to a position whereit is viewable. Moreover, any fatal error will cause the lamp to turnoff, hence preventing the image from being seen.

[0340] If the lamp can be seen, however, any desired error could bepresented. This can include details of custom gobo pallets, lamp status,and bulb life. A non-exclusive list of different errors and their statusfollows.

[0341] Another embodiment is shown in FIG. 6. Specifically, the DMD 100has very exacting temperature requirements. The surface of the DMD needsto be kept at 55° C. or less and preferably below 45° C. The inventors'believe that the life of the DMD will be improved if it can be keptbelow 40° C. The inventors have also recognized the desirability ofmaintaining the temperature differential, or delta T, across the DMD.The inventors postulate that the delta T should not be greater than 15°C.: i.e. the temperature of the front of the DMD must be within 15° C.of the temperature of the back of the DMD. However, this provides aspecial cooling challenge for the DMD when cooled from the rear.

[0342] The solution, illustrated in FIG. 6, is to use a pulse widthmodulated thermo-electric cooler. A thermo-electric cooler is a devicewhich pumps cold from one side to the other using the Peltier effect.When current is applied across the thermoelectric device, one sidebecomes very cold and the other side becomes very hot. This has theeffect of essentially pumping the heat from the cold side to the hotside.

[0343] The overall structure is shown in FIG. 6. The DMD 600 hasthermocouples 602 and 604, respectively, on the front and rear sidesthereof. These thermocouples monitor the surface temperatures of the DMDdevice.

[0344] In operation, incoming light 610 bounces off the front surface612 of the DMD. A certain amount of this light is converted to heatwhich hence travels from the front surface.

[0345] The back surface 614 of the DMD is coated with thermallyconducting paste 616. This past 616 provides a thermal bond between theback surface of the DMD and the thermo-electric cooler 618. The coldside 617 of the thermo-electric cooler 618 is pressed against the backsurface 614 of the DMD. The hot surface 619 of the thermo-electriccooler 618 is pressed against a cooling heat sink 620 via thermallyconductive paste 622.

[0346] In operation, the thermoelectric cooler is energized by anenergizing signal 625. The energizing signal 625, when active, causesthe thermo-electrical cooler to be heated on the hot side 619 and cooledon the cold side 617. However, this could. overcool the back side 614 ofthe DMD 600 relative to the front 612. The signal 625 therefore isprovided at a specified duty cycle less than 100% to avoid this highthermal gradient.

[0347] The DMD is preferably cooled to 30-40° C.

[0348] The operation is shown with respect to the flowchart of FIG. 7.As a baseline initial value, a 50% duty cycle is used for the startingoperation at step 700. This value is used when the DMD is operatingproperly, and during time while the light 610 is being reflected. Thetemperature of the thermocouple 602 is monitored at step 702. When step704 indicates that the front surface of the DMD is getting too hot, theduty cycle is increased by 10% at a time shown at step 706, and a 2minute settling time is allowed. Then the duty cycle can be increased byanother 10% if necessary. If the delta T from front 612 to back 614 getstoo high as detected at step 710, the duty cycle is reduced tocompensate. This allows the overall temperature to be increased some inorder to reduce delta T. When both the delta T and temperature get toohigh, the lamp may need to be doused or dimmed in order to reduce thedelta T. This is shown as an interrupt in FIG. 7.

[0349] An even further preferred system carries out the temperaturesensing and cooling of the device using a service pack device shown inFIGS. 5A and 5B. FIG. 5A shows the unit as laid out in a line. The driveelement 800 produces drive signals for providing cooling power to therear TE device 802 and to the front TE device 804. Front device 802 andrear device 804 are connected by an electrical connection 806, whichalso houses front temp sensor 808 and rear temp sensor 810. This allowsseparately cooling the front surface and rear surface, and alsoseparately sensing the temperatures of the first and second surfaces.

[0350] Although only a few embodiments have been described in detailabove, other embodiments are contemplated by the inventor and areintended to be encompassed within the following claims. In addition,other modifications are contemplated and are also intended to becovered.

What is claimed is:
 1. A device and/or method substantially as shown anddescribed.